As a general update the barrels, flippers, capacitive PCBs, xwhatsit controller PCBs, case molds, and ribbon cables finished production and I need to get the die cast zinc cases themselves, the ultra compact cases, the key molds and keys themselves, and the inner assembly plates made. Unfortunately the die cast zinc case molds and cases have been a bottleneck these past couple months and that continues to put us behind my original schedule. We are now looking at these leaving China in November in my estimate, so it is expected to start shipping out in December. I will not ship out anything that is below my standards for this project.